I-Diamond Wire Cutting Fluid JH-2523

I-JH-2523I-Diamond Wire Cutting Fluid iwuhlobo olusha lomkhiqizo, isetshenziselwa kakhulu inqubo yokusika yazo zonke izinhlobo zezinto eziqinile eziqinile (i-monocrystalline silicon, i-polycrystalline silicon, i-germanium, i-gallium arsenide, i-quartz, i-indium gallium nitride, amagugu, i-non-metallic izinto zokwakha, njll.), izici zokugcoba okuhle kakhulu, i-coo ling, ukumelana nokugqwala, ukumelana nokugqwala kanye nomsebenzi wokuvimbela i-hydrogen.I-silicon surface TTV ngemva kokusikwa incane ngaphandle kocingo futhi ingandisa impilo yocingo lwedayimane.

Izici Zomkhiqizo:
1. Iqukethe izithasiselo zokuhlanza amakhemikhali eziyingqayizivele, ukuze iwafa ye-silicon ihlanzeke kakhulu ngemva kokusikwa, kulula ukuyihlanza ngemva kokusikwa.
2. Iqukethe izithasiselo zokuhlanza amakhemikhali eziyingqayizivele, ukuze i-wafer ye-silicon ihlanzeke kakhulu ngemva kokusikwa, kulula ukuyihlanza ngemva kokusikwa.
3. Igwebu elincane, kulula ukulisebenzisa.
4. Isakhiwo esiyingqayizivele sokumiswa, gwema ipayipi lomshini we-silicon powder deposition block.

Indlela yohlelo lokusebenza:
Lo mkhiqizo ukugxilisa ingqondo kusuka ku-0.2% kuya ku-0.5%, ngokuya ngenqubo ethile ukulungiswa okufanele.
Iphakheji, ezokuthutha kanye nesitoreji: 1kg / umgqomo, 25kg / umgqomo
Isitoreji endaweni yokukhipha umoya, epholile, eyomile

Amanothi:
1. Ukugcinwa ohlelweni lokuvimbela uwoyela oxutshwe namanzi, ngaphandle kwalokho kungase kubangele ukuwohloka komkhiqizo.
2. Uma umbala owuketshezi uba mnyama ngesikhathi sokugcinwa noma ngesikhathi sokusebenzisa, akuthinti umphumela wokusetshenziswa.
3. Ungalidli, ligeze ngamanzi ahlanzekile ngokushesha uma lingena emehlweni ngephutha.esibhedlela esibucayi ukuze sithole ukwelashwa.